PCB Capability

From simple double sided PCB boards to 32 layers PCB boards; From regular boards to HDI boards with blind and buried vias, micro vias, laser drilling, laser and mechanical combined drilling; We provide low, medium and high-volume production.

  • No. of Layers: 2—32 Layers
  • Materials: CEM3, FR-4 Standard , FR4-High-Tg, FR4-Halogen-free, FR4-Halogen-free & High-Tg
  • Max Panel Size: 24” x21”
  • Finish Board Thickness: 0.016”-0.126”
  • Finish Board Thickness: 0.016”-0.126”
  • Min. Spacing/Tracing: 3 mil/3 mil
  • Copper Weight: 0.5oz-5oz
  • Aspect Ratio: 10:1
  • Min. Drilling Hole Diameter: 6mil, 4mil (laser drill)
  • Surface Finish: HASL and lead Fre HASL; Immersion Silver; Immersion Tin; Immersion Gold (ENIG); OSP
PCB Capability

PCB Assembly

We provide Consignment Assembly and Turnkey Assembly services

PCB Assembly

PCB Assembly Capabilities

  • Surface M ount(SM T); Through Hole(THT); M ixed Technology
  • Lead-Free (RoHS), Lead Free Board Assem bly (SM T or
  • BGA / micro BGA Pitch
  • AOI and X-Ray Testing
  • Low, medium and high-volum e production.

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